Industrial Applications &
Strategic Solutions
multicombs® provides the measurement infrastructure for next-generation materials. Our systems bridge the gap between high-fidelity laboratory analysis and 24/7 industrial production environments, delivering actionable data in real-time.
In-Line Production Control
Engineered for high-volume semiconductor fabrication and quantum hardware scaling. Integrate our Multicomb-Laser systems as non-destructive in-line inspection tools to identify critical electronic defects before they impact yield.
- High-Throughput: ASOPS technology ensures data acquisition speeds optimized for moving fabrication lines (< 0.1s / scan).
- Yield Enhancement: Uncover non-radiative recombination centers that conventional optical inspection (AOI) misses.
- 24/7 Reliability: Intrinsically phase-stable Single-Cavity architecture eliminates maintenance-heavy active feedback loops.
Advanced Material Research
Empowering R&D centers and national laboratories to explore ultra-fast dynamics without alignment-burnout. We deliver turn-key MDCS solutions, allowing researchers to focus on data extraction rather than laser stabilization.
- Multi-Spectral Agility: High average output power (>10W) supports highly efficient nonlinear frequency conversion from DUV to MIR.
- Zero Drift: Passive stability ensures reliable long-term data collection over multi-day experimental setups.
- Radical Transparency: No black boxes. Full access to raw data and comprehensive APIs for custom physical analysis.
Primary Industry Verticals
Quantum Hardware
Precision characterization of qubit coherence and relaxation dynamics (T1/T2 times). Mapping of sub-surface defects limiting scalability.
Semiconductors
In-line inspection of SiC, GaN, and GaAs wafers. Early-stage detection of deep-level defects and exciton dynamics directly on the production line.
Photovoltaics
Quantifying energy transfer pathways to optimize charge carrier lifetimes and overall cell efficiency in Perovskite and multi-junction solar cells.
Advanced Materials
Transient absorption signatures and electronic property mapping of emerging 2D materials (e.g., TMDCs) for optoelectronic integration.
Closing the "Metrology Gap"
A direct comparison of acquisition speed versus information depth. Legacy systems force a compromise between throughput and data quality. The multicombs® architecture eliminates this tradeoff.
Evaluate Your Specific Use Case
Every production line and research facility faces unique challenges. Our engineering team provides detailed technical feasibility studies based on your specific material and measurement requirements.
Request Engineering Consultation